Vias: Blind, Buried and Beyond

The Z-direction on a PCB multi-layer is remarkably restrictive. We do not draw copper from one layer to the next. We must make use of a copper structure called the via. Over time, more via options have been made available to accommodate small components and densely populated boards.

In this video, we will discuss:

• Sanity check - Make sure that the desired via type works with the stack up
  

• Annular rings - the equation to ensure the right fit/hit
  

• Explore non-traditional vias types - microvias, back drilled vias, vias-in-pad
  

• Documentation - what automatically gets generated and what needs to be provided as a fabrication note
  

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